Reflex Photonics branches out to New Markets with the introduction of two new series of transceivers.

Reflex Photonics is proud to introduce two new lines of products targeting high-end space and industrial applications. Leveraging its expertise in embedded optical communication modules for defense and aerospace, Reflex Photonics is now offering the LightSPACE™ radiation-hardened optical transceivers for space applications and the LightVISION™ robust, screw-in optical module for industrial applications. From terrestrial to space applications and beyond, Reflex is committed to becoming the prime supplier for all demanding optical interconnect applications.

The LightSPACE embedded optical modules are rugged devices engineered to withstand radiation doses as per the European Cooperation for Space Standardization ECSS-Q-ST-60-15C, while offering high bandwidth (greater than 150 Gbps) in a chip-size package.

The LightVISION module is a robust, screw-in, industrial RoHS generic part that could have a variety of optical interfaces such as the LightSNAP. LightSNAP adds a standard MPO pluggable optical interface to the LightVISION module. This approach offers a standard MPO cable connection with a robust, board mounted optical engine providing small size (footprint) and convenient optical cabling at the same time.

Guillaume Blanchette, PM at Reflex Photonics adds:

With the introduction of the LightSPACE and the LightVISION line of products in Q1 2018, we have broadened our portfolio to address the rugged, high-speed optical interconnect needs of equipment developers for space and industrial markets. The growing number of applications we will be able to develop with these new customers is truly exciting.
One such applications is high-speed cameras where the LightVISION will outclass pluggable optical module on environmental requirements, as well as size and power consumption.

Reflex Photonics on track for record sales for 2017

Reflex Photonics is pleased to announce it will achieve record sales of optical modules for 2017, beating its record 2016 year by a huge amount.

Demand for Reflex Photonics rugged optical modules has double each year for the past two years and is expected to double again in 2018.

Reflex scales up manufacturing to meet demand for its embedded optical modules

In order to face this increased demand, expansion projects launched in spring 2016, as well as an investment of nearly $3,5 million from the enterprise and its partners will enable Reflex Photonics  to expand its production capacity to increase sales and exports.

Reflex Photonics headquarters | 16771 Ch Ste-Marie, Kirkland, QC H9H 3L1

Noel Dube, CEO of Reflex Photonics adds:

We are grateful to our customers and staff that has supported and helped us build the most reliable and rugged optical modules in the industry.  We continue to expand our product lines and expect to see another record year in 2018.

Housed in a ISO-7 (Class 10k) monitored clean room environment our equipment and personnel are dedicated to producing the highest quality optical modules and assemblies.

Learn more about Reflex Photonics, 40,000 ft2 facility.

Gerald Persaud, VP Business Development of Reflex Photonics adds:

The growing demand for situational awareness, electronic warfare and IoT is driving a change to fiber optics to handle the enormous amount of information from advance digital radar, cameras and high-performance computers. Reflex is investing in world class equipment and staff to deliver the highest quality parts with shorter lead times.

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Board Edge Mount Active Optical Connector

By: Jocelyn Lauzon, Tomasz Oleszczak, Saïd El Kharraz from Reflex Photonics
Eric Hickey, Sean Langelier from Amphenol Aerospace

Reflex Photonics has developed compact 40G full duplex (4+4) 10 Gbps/lane optical fiber transceivers for harsh environment applications such as Aerospace and Defense.
These products were made to be embedded on printed-circuit boards in close proximity to high speed electronics in high performance embedded computing systems to optimize their performance. Going one step further, the industry was asking for these transceivers to be integrated in board edge connectors to free-up more space on the board and avoid optical fiber handling. This implied important challenges for bi-planar position tolerancing between the electrical interface on a horizontal board and the optical interface based on a multi-fiber MT ferrule, in an orthogonal plane.

The final configuration of the active optical connector is called the LightCONEX.

LightCONEX® is developed in partnership with Amphenol Aerospace

Reflex Photonics LightABLE optical transceivers

LighABLE embedded transceiver

Reflex Photonics Inc. has developed compact 12.5 Gbps/lanes optical fiber transceivers for harsh environment applications such as Aerospace and Defense.
The LightABLE™ product series offers chip size transceivers with the following features:

  • Performance: 10Gbps/ch from −40 ºC to 100 °C
  • Sensitivity: better than −12 dBm for BER 10−12
  • Multimode OM3 fiber
  • 850 nm wavelength
  • Standard MT parallel fiber connector
  • Embedded, board mount, close proximity to FPGA/switch chip

Reflex Photonics LightCONEX optical transceivers

LightCONEX blind mate optical interconnect for VPX embedded computing systems

VPX blind mate active optical plug-in to backplane connector for embedded communication. Reference VITA 66 standards; interface under discussion VITA 67.3.

OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments.

Define interfaces between plug-in modules and chassis for harsh environment applications.

LightCONEX description

The design was made to respect VITA 66.0 optical interconnect on VPX base standard. The tolerances on the position of the electrical pins in the horizontal plane are ±50 µm. The lateral / longitudinal RMS tolerances on the optical connector, in the orthogonal plane,  prior to connection, are ±100 µm and the angular tolerance is ±0.47º. These tolerances include the ±50 µm tolerances of the electrical pins in the orthogonal plane.
In order to limit the additive position tolerance over 2 orthogonal planes, alignment pins are used for the horizontal plane, through the LightCONEX housing, the same housing that supports both the electrical and optical interfaces. In the orthogonal plane, where the optical connection is made, the precision of the alignment is ensured by the combination of 3 guides. The VPX pin on the backplane and interface of the plug -in module offers a preliminary gross alignment. A guide tab on the backplane insert and guiding shroud sitting on top of the MT ferrule interface provides a more precise alignment, that is then completed by the MT ferrule dowel pins on the MT ferrule interface, ensuring 12 fiber array to 12 fiber array physical contact with optical transmission losses less than 0.3dB for all channels for 50 µm core diameter OM3 fibers transmitting 850 nm optical signals. The vertical precision tolerance on the position of the optical fibers in the ferrule is initially ±200 µm, prior to connection, including tilt angle. The optical connector interface can resist a mated force (between the plug-in module and backplane) of 7.8 N (1.75 lb) for the MT ferrule and a total tensile force of 28.25 N (30 g/contact). 

Bi-planar position tolerancing

Bi-planar position tolerancing
  • Electrical pins in the horizontal plane: ±50 mm
  • Lateral/longitudinal RMS tolerances on optical connector in orthogonal plane: ± 100 mm, ± 0.47°
  • Vertical tolerance on optical fibers (including tilt): ±200 mm
  • Alignment pins on cLGA socket, through housing

Optical connection alignment precision

Optical connection alignment precision is ensured by the combination of 3 guides:

Optical connection alignment precision is ensured by the combination of 3 guides:

  1. VPX key guide pin
  2. Guiding shroud
  3. MT ferrule alignment pins

The transceiver is screwed-in, through the host PCB, into the optical transceiver housing, through an LGA (land grid array) electrical socket. Amphenol’s cLGA socket offers potential multiple connection /disconnection cycles while maintaining a low -profile needed to ensure high-density rack-mountability for these board-edge active connectors.

cLGA socket or connector

cLGA socket or connector

Exploded view of the board assembly

Exploded view of the board assembly

Environmental Qualification Tests

The environmental qualification effort that is planned for this new product includes 1000 thermal cycling form -40 to 85°C as per MIL -STD-883 method 1010, vibration tests as per MIL -STD-883 method 2007, live vibration tests as per MIL -STD-1344 method 2005, mechanical shock tests as per MIL -STD-883 method 2002 and MIL -STD-1344 method 2004, thermal shock tests as per MIL -STD-883 method 1011, damp heat tests as per MIL -STD-202 method 103, salt fog as per MIL -STD-1344 method 1001, sand & dust as per MIL -STD-810 method 510, insertion/extraction force as per MIL -STD-1344 method 2013 and 500 mate/unmate cycles as per MIL -M-28787.

 

Performance test setup

Performance Test Setup. TX

Transmit setup

Performance Test Setup. RX

Receive setup

Results of design verifications tests

Rack-mount integrations were completed in order to confirm the volume manufacturing compatible assembly procedure and the required mechanical tolerance accuracy of the connector through blind mating. Moreover, through design verification tests on the transceiver module, we confirmed the excellent performance of these active optical connectors for operating temperature ranges of at least −40 ºC to 85 °C, at 10 Gbps per lane, giving bit error rates better than 10−12 for sensitivities of at least −12 dBm, when all 4+4 lanes are active simultaneously at 10 Gbps. Prototypes have been submitted to 1000 temperature cycles from −40 ºC to 85 °C and no significant degradation of their performances were observed after completion of these tests.

Results of design verifications tests at −40ºC

LightCONEX eye digram at −40 ºC

Results of design verifications tests at room temperature

LightCONEX eye digram at room temperature

Results of design verifications tests at 85ºC

LightCONEX eye digram at 85 ºC

Results of Environmental Qualification Tests

Vibration: based on MIL-STD-883, Method 2007.3; 20 Hz to 2000 Hz, 20 g, 16 min par axis: PASS
Thermal shock: MIL-STD-883, Method 1011.9, 20 cycles, 0 ºC to 100 °C, 10 min dwell time, 5 s transient time: PASS
Temperature cycling: MIL-STD-883, Method 1010.8; 1000 cycles −40 ºC to 85 °C, ramp > 10 °C/min, 5 minutes dwell time: PASS

Upcoming Environmental Qualification Tests

Damp heat: MIL-STD-202, Method 103B; 85% humidity, 85°C, 500 h
Cold storage: MIL-STD-810, Method 502.5; −57 °C, 168 h
Temperature cycling: MIL-STD-883, Method 1010.8, 100 cycles, −57 ºC to 100 °C, ramp > 10 °C/min, 5 minutes dwell time .
Mechanical shock: MIL-STD-883, Method 2002.4; 500 g, 0. 5 ms pulse, 5 repetitions, 6 directions.

VITA 46 Environmental Qualification Tests

Live Vibration: MIL-STD-1344, Method 2005, Test Condition V, Letter D; 1.5 h per axis, 0.1G2/Hz (see solid curve below)
Live Vibration and Temperature Cycling: Same as above, plus −40 ºC to 100 °C cycling with 30 min dwells and 15 min ramps
Mechanical Shock: MIL-STD-1344, Method 2004, Test Condition A; 50 g in perpendicular axis, 80 g in other axes, 11 ms, half sine, 3 repetition, 6 directions
Humidity/Temperature Cycling: MIL-STD-1344, Method 1002, Type III; 85 to 95% humidity, with 28 ºC to 71 °C temperature cycles over 24 h, 10 cycles for a total of 240 h
Salt Fog: MIL-STD-1344, Method 1001, Test C; 35 °C, 0.5 to 3 ml of NaCl solution per hour for each 80 cm2 area for a total of 500 h
Sand and Dust: MIL-STD-810, Method 510.4, Procedure I; Blowing dust particle size < 150 mm, velocity 1750 ft/min; Blowing sand particle size > 150 mm but < 850mm, velocity 5700 ft/min
Durability with Misalignment: MIL-M-28787, 500 mate/unmate cycles with an initial misalignment of 2 mm

Live Vibration: MIL-STD-1344, Method 2005, Test Condition V

Conclusion

  • Introduction of the LightCONEX: a new board edge mount active optical connectors
  • A novel VPX blind mate active optical plug-in to backplane connector for embedded communication systems
  • The plug-in printed-circuit board interface integrates a low-profile, rugged, 4+4 channels fiber optic transceiver (or 12TX, or 12RX) operating at 10 Gbps per lane, over a temperature range from −40 ºC to 85 °C
  • Future perspective: 28Gbps per lane and 12+12 transceivers

Reflex Photonics presented a paper at AVFOP 2017

A paper written by Mr. J. Lauzon, T. Oleszczak, and S. El Kharraz and entitled Board Edge Mount Active Optical Connector  has been presented at the Avionics and Vehicle Fiber-Optics and Photonics Conference 2017 (AVFOP).

Summary of the article

Reflex Photonics Inc. has developed compact 40G full duplex (4+4) 10Gbps/lane optical fiber transceivers for harsh environment applications such as Aerospace and Defense.
These products were made to be embedded on printed-circuit boards in close proximity to high speed electronics in high performance embedded computing systems to optimize their performance. Going one step further, the industry was asking for these transceivers to be integrated in board edge connectors to free-up more space on the board and avoid optical fiber handling. This implied important challenges for bi-planar position tolerancing between the electrical interface on a horizontal board and the optical interface based on a multi-fiber MT ferrule, in an orthogonal plane. We will present how these challenges were confronted with success.

The final configuration of the active optical connector is called the LightCONEX. 

LightCONEX blind mate optical interconnect for VPX embedded computing systems

Avionics and Vehicle Fiber-Optics and Photonics Conference
November 7 to 9, 2017

Sheraton New Orleans Hotel
New Orleans, Louisiana USA

Learn more about the AVFOP Conference 

Reflex Photonics demonstrates its LightABLE transceivers can drive older 100 µm fiber optic cables, extending aircraft life and reducing upgrade cost.

LightABLE optical transceiver delivers error-free operation at 10 Gbps with older 100 µm fiber thus, alleviating the need to replace the installed optical cables.

Reflex Photonics is proud to announce its LightABLE™ embedded optical module has demonstrated that it can directly drive 100 µm fiber optic cables commonly found in older aircraft, eliminating the need to re-cable the aircraft to achieve higher interconnect bandwidth.
New or upgraded sensors and computer systems offer great benefits to existing military and commercial aircraft but often necessitate interconnect bandwidth of 10 Gbps or more. Unfortunately, replacing older 100 µm optical fibers in aircraft to support this higher bandwidth can be prohibitively expensive. Reflex Photonics solved this problem by demonstrating its LightABLE optical transceiver delivers error-free operation at 10 Gbps with older 100 µm fiber thus, alleviating the need to replace the installed optical cables.
In addition, the LightABLE transceiver will operate with newer 50 µm fiber (OM3, OM4, or OM5) to deliver interconnect bandwidth well beyond 25 Gbps on distances up to 100 m.

Reflex Photonics develops and produces rugged high-speed optical transceivers for Military, Industrial, and Commercial communications. LightABLE is a chip size embedded optical transceiver capable of transmitting or receiving 150 Gbps over 12 parallel lanes in harsh environments where temperatures extremes of -57ºC to 125ºC is common. A unique feature of the LightABLE is its compatibility with low-cost mass production solder reflow processes. Optical modules in general will not survive solder reflow temperatures of 220ºC and must be either socketed or hand soldered. LightABLE reflow ability gives low assembly cost, strong attachment, low profile, and excellent signal integrity.

Gerald Persaud, Vice President of Business Development commented:

We are excited to demonstrate the flexibility of our LightABLE optical module by offering a simple but effective way to upgrade aircraft interconnect bandwidth with no change to the installed fiber plant. This is another example of LightABLE exceeding performance expectations.

Optical transceivers empower wafer defect review system and offer the most viable data transfer solution for advanced machine vision challenges.

Hiigh-speed optical transceivers offer the most flexible solution to the data transfer issues faced by scanning electron microscope (SEM)-based semiconductor defect review system and machine vision integrators.

Reflex Photononics’ high-speed optical transceivers offer the most flexible solution to the data transfer issues faced by scanning electron microscope (SEM)-based semiconductor defect review system and machine vision integrators.
These integrators are faced with the challenge of embedding sensors with high resolution and high frame rates. Furthermore, new intelligent machines with real-time adaptive process enabling more accurate defect classification, also rely on faster and better data transfer. These challenges cannot be met efficiently and reliably with copper-based data transfer solutions: for data integrity, link reliability, and error-free data transfer at rates superior to 10 Gbps, optical link becomes the only viable solution.
The LightABLE SR12 and the SNAP12 embedded transceivers are used to transfer up to 150 Gbps from SEM defect-review system sensor to the system microcontroller or computer. These optical components are tested to give BER under E-15 over -40 ºC to 100 ºC operating temperature range. Our transceivers offer maximum flexibility in terms of board mounting options and facilitate board design. In addition, our optical transceivers can also be used on the control path where they enable sending of control data to help complex process adapt in real time.

Guillaume Blanchette, PM at Reflex Photonics, adds.

The chipmakers defect review challenges are growing as processes move to smaller and smaller node technology like 10 nm and 7 nm. The ability to discriminate killer defect from viable defect rely more and more on high-end imaging techniques.
The sensor resolution and capture speed must increase at the same time to improve the machine throughput and keep capturing the smallest defect efficiently. Only optical interconnect can break the data transfer bottleneck of these advanced defect review systems and machine vision applications.

New SNAP12 120G for machine vision and avionic IFES applications with operation temperature rating up to 95 ºC.

New SNAP12 120G for machine vision and avionic IFES applications with operation temperature rating up to 95 ºC.

Reflex Photonics is proud to announce the launch of new SNAP12 120G modules targeting advanced manufacturing, industrial automation, and machine vision markets. The operation temperature now ranges from −40 ºC to 95 ºC. Reflex Photonics is also continuously improving its SNAP12 range for its current inflight entertainment system (IFES) clients.
This SNAP12 is directly addressing technical needs brought by the increasing data bandwidth demand of high-speed and high-resolution machine vision systems developed to tackle advanced manufacturing and automation challenges.
Reflex Photonics’ new SNAP12 are offered in both commercial (0 ºC to 70 ºC) and industrial operating temperatures (−40 ºC to 95 ºC) ranges at speeds up to 120 Gbps with data rate up to 10.3125 Gbps per lane. These modules underwent extensive testing to meet requirements for harsh environments and are 100% compatible with the industry standards.

SNAP12 are 12-lane parallel optical modules with a standard chassis-mount MPO interface. They are self-contained electrical-to-optical converters requiring no internal fiber management or handling. This is important for clients that prefer not to handle fragile optical cables. The simplicity and performance of SNAP12 makes them ideal module for many avionics, defense, industrial automation, and medical applications.

Guillaume Blanchette, product manager, adds:

Reflex Photonics is eager to support customers with their advanced manufacturing, automation, and machine vision designs and applications.
Reflex Photonics’ SNAP12 optical modules continue to be the product of choice for commercial avionic inflight entertainment systems.
We are committed to long-term support for the SNAP12 and to the broadening of this product line for higher data rates and I/O.

Rugged Optical Transceivers for Embedded Computing Systems

The objective of this white paper is to show how important and critical optical interconnect is becoming in the development of high-performance embedded systems.
By: Gérald Persaud, VP Business Development and Michel Têtu, Senior Business Development Advisor

Embedded Systems Market to Reach $133B by 2020*

Eyes and ears everywhere

For military and aerospace applications, C4ISR (Command, Control, Compute, Communicate, Intelligence, Surveillance, Reconnaissance) is invaluable for almost instantaneous high-end decision making. 

*: MarketsandMarkets

Command, Control, Compute, Communicate, Intelligence, Surveillance, Reconnaissance

Intelligence, Surveillance, and Reconnaissance Process

The Intelligence, Surveillance and Reconnaissance process (ISR) requires the collection and processing of signals generated by a large amount of sensors of various types like active electronically scanned array (AESA) radars, high resolution cameras, sonars and so on. Analog signals are digitized and transmitted to a high performance embedded computing unit (HPEC) for data fusion and processing through high bit-rate fiber-optic links. Through deep learning algorithms, actions to be taken are identified and communicated to decisional centers. 

ISR Technology Trends

HPEC are made of multiple high-speed microprocessors, memory and storage set on electronic boards usually interconnected through copper backplane circuitry.
However with the data rate of these interconnects reaching over 10 Gbps, optical interconnects begin to be the preferred choice due to their high bandwidth, high density I/O, low loss, low weight, and immunity against EMI.

  • Sensors: higher resolution cameras and radars
  • Processor: multicore, low power GPGPU, GPP, FPGA
  • Storage: solid state, small, rugged, reliable (RAID)
  • Sensor fusion: correlate information from sensors
  • Computing: Virtualization, parallel processing 
  • Small SWaP: more capability for SFF (3U VPX)
  • All digital: multi-purposed, software defined functionality
  • Intelligent: learning machines
  • Data rich: real-time and historical data
  • Secure: hack-resistant communications
  • Reliable: no single point failure
  • Small: more payload for other systems
  • Scalable: simple upgrades, long life
  • Multi-purposed: target ID, weather, communications.
Computerized Command, Control, Communications, Intelligence, Surveillance

Illustration of the relation between the different elements of C4ISR systems (Command, Control, Compute, Communicate, Intelligence, Surveillance, Reconnaissance).

Applications of optical interconnect in some high-performance systems

Space Fence Radar: Toward all-digital AESA radar

Learn more on the Space Fence project 

US Air Force Space Surveillance Network

Active electronically scanned array (AESA) radar
  • Detect, track, catalog satellites and debris on earth orbits
Transmitter array
  • S-Band (2 GHz to 4 GHz)
  • 36 000 independent radiating elements
  • Can generate thousands of radar beams
Receiver array
  • Separate from transmitter array
  • 86 000 independent receiving elements
  • DBF and frequency multiplexing allow for thousands of received beams
Space fence US Air force Space Surveillance Network

ISR technology trends: BAE ARGUS IS system

Learn more on the BAE ARGUS system

  • Four high-resolution visible light cameras
  • Uses 368 CCD COTS 5 Mp cameras
  • 4×48 fiber optical ribbon cables
  • 16×SNAP 12 @ 3 Gbps offering 600 Gbps total I/O throughput

Optical interconnect is used on ARGUS IS system

  • High BW, low latency
  • Small SWaP
  • High density
  • Defines system performance
Optical interconnect in BAE Argus IS
Autonomous Real-Time Ground Ubiquitous Surveillance Imaging System (ARGUS-IS)

Electrical vs optical interconnect power consumption

This diagram shows a rough evaluation of electrical power consumption for the connection of a sensor to an embedded computer system. Here we only consider the front-end of each system. Optic interconnect need 2 to 3 times less power than an electrical connection.

Electrical vs optical interconnect power consumption

Summary of Embedded Optics Benefits

LighABLE embedded transceiver

Reflex Photonics chip size rugged parallel optic transceivers meet the requirements for harsh environment applications. 

Performance

  • Proven: Thousands used in aerospace and defense applications
  • Scalable BW: 28 Gbps+
  • Receiver sensitivity: –12 dBm
  • Low bit error rates: 10−15
  • Low loss: 0.003 dB/m (OM3 @850 nm)
  • Reach: 300 m (OM3 @10G)
480G full duplex I/O card

480G full duplex I/O. FPGA processors, server cards, and cellular systems.

 

Small SWaP-C

  • Chip size optical transceivers
  • Less than 5 mm high
  • Light weight electronics and glass fiber
  • I/O density: 48 fibers in MT connector
  • Low power consumption: 1.2 W for 12 lanes @10 Gbps
Optic fiber offer much better I/O density that copper interconnect.

Micro-coaxial connectors compared to optical MT ferrule connector

 

Rugged

  • Complies with Telcordia GR-468-CORE and MIL-STD-883E standards for severe environmental conditions.
  • Operating temperature: −40 °C to 85 °C operation @ 10 Gbps
  • Storage temperature: − 57 °C to 125 °C
  • Moisture and thermal shock resistant
  • EMI and EMP immune
Optic fiber are immune to electro magnetic interferences.

Harsh environment

 

VPX optical interconnect standards

ANSI/VITA Standard

  • ANSI/VITA 66.0: Optical Interconnect On VPX
  • ANSI/VITA 66.1: Full Size MT Variant
  • ANSI/VITA 66.2: ARINC 801 Variant
  • ANSI/VITA 66.3: Mini-Expended Beam Variant
  • ANSI/VITA 66.4: Half Size MT Variant
VITA 66.X standard
VITA 66.X standard

Image courtesy of TE Connectivity

VITA 66.4 backplane
VITA 66.4 standard

Image courtesy of ELMA

Under consideration

VITA 65: Open VPX
VITA 67.3C: VPX: Coaxial & Optical Interconnect,
VITA 76: High Performance Cable Standard
VITA 78: Space VPX Systems
VITA 78.1: Space VPX Lite
VITA 74 VNX: Small Form Factor VPX

VITA 67.3C standard
VITA 67.3C standard

Image courtesy of TE Connectivity

LightCONEX blind mate optical interconnect

For a higher level of integration, Reflex Photonics in collaboration with Amphenol Aerospace, developed optical blind mate connectors where the optical transceiver is directly embedded in the plug-in module connector  following ANSI/VITA VPX technology.

  • Supports 2 level maintenance
  • Integrates optical transceiver into plug-in module connector
  • Less board space needed for optical interface
  • Fits VITA 66.4 backplane aperture for upgrades
  • No need for fiber optic handling
VPX board with VITA 46 and LightCONEX plug-in connectors.

VPX board with VITA 46 and LightCONEX plug-in connectors.

VPX backplane with LightCONEX blind mate optic

ELMA 3U VPX backplane with VITA 46 and LightCONEX connectors.

VPX backplane with LightCONEX blind mate optic

Close-up of the LightCONEX plug-in module connector.

VPX backplane with LightCONEX blind mate optic

Close-up of the LightCONEX backplane connector.

VPX optical solutions with Reflex Photonics embedded optics

Amphenol VPX media converter

  • 6U VPX media converter
  • Converts backplane high-speed signal to front optical and electrical Ethernet I/O
  • 32 × 10G BASE SR in a VITA 66.1 connector
  • 4 × 10G BASE-T and 8 × 1G BASE-T
Amphenol VPX media converter. Converts backplane high-speed signal to front optical and electrical Ethernet I/O

Interface Concept Optical FMC Board

  • Transceiver board (12TX + 12RX)
  • 120 Gbps full duplex
  • Supports front panel Optical Interface
  • Interfaces with 3U VPX FPGA boards
 New generation Optical FMC cards use LightABLE LH SR12 embedded optical transceivers.

Meritec Active Optical Module

  • Extends electrical reach to 100 m @10Gbps
  • Converts electrical to optical signals
  • Size 17 VITA 76 electrical connector
  • 12-lane MT optical in a size 11 shell
Meritec Active Optical Module.  Converts electrical to optical signals Size 17 VITA 76 electrical connector 12-lane MT optical in a size 11 shell.

In conclusion

Reflex Photonics rugged parallel optic transceivers meet the requirements for harsh environment applications and offer:

High performance with less SWaP-C

Operation under industrial temperature range (-40°C to 85°C) with BER as low as 10−15 delivering 10 Gbps/ch and –12 dBm sensitivity. Less than 5 mm high. Low power consumption 100 mW/ch.

Proven

Thousands used in aerospace and defense applications.

 

Rugged

Fully qualified following Telcordia GR-468-CORE and MIL-STD-883E standards for severe environmental conditions. 

Reliable

Successful 2500 h Accelerated Life Testing @ 100 °C.
Storage temperature from −57 °C to 125 °C.

Winning edge for design engineers

Reflex Photonics launches a line of Optical Testers to simplify testing of its LightABLE rugged transceivers and of optical interconnects.

The Optical Testers are the perfect vehicle for testing and experiencing the LightABLE SR4 and SR12 transceiver modules.

Recognizing the need for a ready-made test bench for its line of transceiver modules, Reflex Photonics introduces a complete line of Optical Tester for BER measurements on the LightABLE™ SR4 and SR12 rugged embedded transceivers and optical interconnects.
Currently, Reflex Photonics offers these different optical test instruments:

Optical Tester SR4 40G (Enables BER measurement)
Optical Tester SR12 120G (Enables BER measurement)
Optical Generator/Tester SR12 120G (Generates PRBS and includes BERT capability)

The Reflex Photonics Optical Testers will speed up the LightABLE performance validation and confirm successful integration into your system as it enables BER and eye diagram tests over the SR4 and SR12 transceivers. In addition, those products will enable your communication system BER assessment.
The Optical Generator/Tester integrates a PRBS (pseudo random bit signal) generator and an embedded BER measurement capability. This instrument acts like a BERT as it will directly perform optical communication system BER assessment. It will also act as an optical cross-connect OXC.

Dr. Jocelyn Lauzon, V.P. Engineering at Reflex Photonics adds: 

These products offer an efficient, proven, and elegant ready-made solution that takes the guesswork out of testing performance and functionality of Reflex Photonics’ LightABLE.
Obviously, you can do the characterization of our transceiver, but if you replace the loopback cable by a bi-directional parallel optic communication system, the Optical Tester can be used to characterize the performance of a whole communication system. The communication bit rate and protocol can be changed, so the Optical Tester can be used to test different system architectures.

Reflex Photonics announces new operating temperature absolute rating on the LightABLE

LightABLE embedded transceiver

Reflex Photonics has proven that its LightABLE™ multichannel 120 Gbps* rugged optical transceivers can withstand temperature ranging between −55 ºC and 100 ºC, thus reaffirming Reflex Photonics commitment in delivering first-in-class optical modules for harsh environment applications. 
Reflex Photonics is relentlessly testing its line of LightABLE transceivers and constantly improving their ruggedness.

Guillaume Blanchette, product manager, says:

We are quite excited to announce that our LightABLE transceivers can withstand temperature ranging between −55 ºC and 100 ºC. This result reaffirms the reliability of the Reflex Photonics LightABLE transceivers and the suitability of these products for field deployment in harsh environments such as those found in military and space applications.

*: SR12 version