Wafer inspection
Hiigh-speed optical transceivers offer the most flexible solution to the data transfer issues faced by scanning electron microscope (SEM)-based semiconductor defect review system and machine vision integrators.

Reflex Photononics’ high-speed optical transceivers offer the most flexible solution to the data transfer issues faced by scanning electron microscope (SEM)-based semiconductor defect review system and machine vision integrators.
These integrators are faced with the challenge of embedding sensors with high resolution and high frame rates. Furthermore, new intelligent machines with real-time adaptive process enabling more accurate defect classification, also rely on faster and better data transfer. These challenges cannot be met efficiently and reliably with copper-based data transfer solutions: for data integrity, link reliability, and error-free data transfer at rates superior to 10 Gbps, optical link becomes the only viable solution.
The LightABLE SR12 and the SNAP12 embedded transceivers are used to transfer up to 150 Gbps from SEM defect-review system sensor to the system microcontroller or computer. These optical components are tested to give BER under E-15 over -40 ºC to 100 ºC operating temperature range. Our transceivers offer maximum flexibility in terms of board mounting options and facilitate board design. In addition, our optical transceivers can also be used on the control path where they enable sending of control data to help complex process adapt in real time.

Guillaume Blanchette, PM at Reflex Photonics, adds.

The chipmakers defect review challenges are growing as processes move to smaller and smaller node technology like 10 nm and 7 nm. The ability to discriminate killer defect from viable defect rely more and more on high-end imaging techniques.
The sensor resolution and capture speed must increase at the same time to improve the machine throughput and keep capturing the smallest defect efficiently. Only optical interconnect can break the data transfer bottleneck of these advanced defect review systems and machine vision applications.